Document Type : Original Article
Authors
1 Department of Textile Engineering, Yazd University, Yazd, Iran
2 Department of Electrical and Computer Engineering, Yazd University, Yazd, Iran.
Abstract
In recent years, much attention has been given to various printing techniques to produce low-cost electronic ingredients and equipment. Inkjet printing is one of the most promising methods for printing circuit ingredients in one step almost on any substrates. In this study, the inkjet printing technique was employed for chemical deposition of silver nanoparticles by ejecting aqueous solutions of silver nitrate as metal salt and ascorbic acid as reducing agent on flexible substrates such as paper and fabric. Inkjet-deposited silver patterns were used as capacitors in electrical circuits and their performance was tested. Different values of capacitance were gained by a simple change in the size and shape of the printed capacitor. The highest capacitance values gained on an inkjet-deposited capacitor (a parallel plate capacitor with 1 cm2 overlapped area) on paper and fabric were 85.1 and 1370 pF, respectively. Inkjet-printed capacitors (interdigital capacitors with six fingers) could display a capacitance around 20 and 6 pF on paper and fabric, respectively. Levels of capacitance achieved by the new inkjet deposition technique can successfully match and exceed the capacitance levels of conventional capacitors produced using current multi-step fabricating methods.
Keywords
Capacitor 515, no. 19, pp. 7692-7696, 2007. [10] V.G. Shah and D.B. Wallace, “Low-cost solar cell fabrication by drop-on-demand inkjet printingˮ, In: Proceedings of IMAPS 37th Annual International Symposium on Microelectronics, Long Beach, CA, USA, pp. 14-18, 2004. [11] M. Mäntysalo and P. Mansikkamäki, “An inkjetdeposited antenna for 2.4 GHz applicationsˮ, AEUInt. J. Electron. Comm., vol. 63, no. 1, pp. 31-35, 2009. [12] R. Das, K. Ghaffarzadeh, and X. He, “Printed & organic electronics forecasts, players & opportunities”, 2017–2027, ID TechEx report, 2017. [13] Y. Lee, J.R. Choi, K.J. Lee, N.E. Stott, and D. Kim, “Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics”, Nanotechnology, vol. 19, no. 41, pp. 415604, 2008. [14] S.M. Bidoki, D. McGorman, D.M. Lewis, M. Clark, G. Horler, and R.E. Miles, “Inkjet printing of conductive patterns on textile fabrics”, AATCC Review, vol. 5, no. 6, pp. 17-22, 2005. [15] S.M. Bidoki, D.M. Lewis, M. Clark, A. Vakorov, P.A. Millner, and D. McGorman, “Inkjet fabrication of electronic components”, J. Micromech. Microeng., vol. 17, no. 5, pp. 967, 2007. [16] B. Derby and N. Reis, “Inkjet printing of highly loaded particulate suspensions”, MRS Bull., vol. 28, no. 11, pp. 815-818, 2003. [17] S.M. Bidoki, J. Nouri, and A.A. Heidari, “Inkjet deposited circuit components”, J. Micromech. Microeng., vol. 20, no. 5, pp. 055023, 2010. [18] I.J. Bahl, “Lumped elements for RF and microwave
circuits”, Artech House, USA, 2003. [19] S. Sankaralingam and B. Gupta, “Determination of dielectric constant of fabric materials and their use as substrates for design and development of antennas for wearable applications”, Instrum. Meas., IEEE Transactions on, vol. 59, no. 12, pp. 3122-3130, 2010. [20] L. Yang, A. Rida, R. Vyas, and M.M. Tentzeris, “RFID tag and RF structures on a paper substrate using inkjetprinting technology”, Microw. Theory Techniques, IEEE Transactions on, vol. 55, no. 12, pp. 2894-2901, 2007. [21] B.S. Cook, J.R. Cooper, and M.M. Tentzeris, “Multilayer RF capacitors on flexible substrates utilizing inkjet printed dielectric polymersˮ, Microw. Wirel. Components Lett., IEEE, vol. 23, no. 7, pp. 353-355, 2013. [22] G. McKerricher, J. Gonzalez Perez, and A. Shamim, “Fully inkjet printed RF inductors and capacitors using polymer dielectric and silver conductive ink with through viasˮ, Elec. Devices, IEEE Transactions on, vol. 62, no. 3, pp. 1002-1009, 2015. [23] G. McKerricher, M. Vaseem, and A. Shamim, “Fully inkjet-printed microwave passive electronicsˮ, Microsy. Nanoeng., 3, 16075, 2017. [24] F.P. Casares-Miranda, P. Otero, E. Marquez-Segura, and C. Camacho-Penalosa, “Wire bonded interdigital capacitor”, IEEE Microw. Wirel. Components Lett., vol. 15, no. 10, pp. 700-702, 2005. [25] A. Manut, A.S. Zoolfakar, N.A. Muhammad, M. and Zolkapli, “Characterization of Inter Digital capacitor for water level sensor”, In: IEEE Regional Symposium on Micro and Nanoelectronics (RSM 2011), pp. 359363, 2011.
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